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Shanghai Headquarters of the Central Bank: The amount of cross-border RMB settlement in Shanghai in November was 2,491.8 billion yuan. According to the news of Shanghai Headquarters of the Central Bank, as of the end of November, there were 102 banks in Shanghai that submitted information on cross-border RMB settlement business, with a settlement amount of 2,491.8 billion yuan in November and a cumulative settlement amount of 27,151.9 billion yuan from January to November.Xia Yiping's internal letter was alleged to have been copied from Weilai Li Bin. Xia Yiping, CEO of Jiyue, released an internal letter on the afternoon of 11th, acknowledging that the company was encountering difficulties and needed to adjust immediately. Some netizens pointed out that part of Xia Yiping's internal letter copied the internal letter of Weilai Li Bin in 2023. Xia Yiping's internal letter mentioned that the following four things must be done well in the new entrepreneurial period: 1. Adhere to the long-term investment in core technologies to maintain the leading edge; 2. Strengthen sales and service capacity building to cope with fierce market competition; 3. Merge departments and posts with duplicate functions and change inefficient internal workflow; 4. Reduce projects that cannot improve financial performance in the short term. In 2023, Li Bin's internal letter also mentioned: ensure long-term investment in core key technologies and maintain the leading edge of technology and products; Ensure that sales and service capabilities can cope with fierce market competition; Ensure that 9 core products of 3 brands are listed as scheduled; Organize efficiency improvement, merge redundant departments and posts, change inefficient internal workflow and division of labor, and cancel inefficient posts; Improve the efficiency of resources, postpone and reduce the project investment that can not improve the company's financial performance within 3 years. (Sina Technology)OPENAI API、CHATGPT、SORA流量基本恢复。

The Thai government plans to launch digital wallet distribution in 2025.What is the significance of index funds being included in the list of individual pension funds? E Fund: To build an ecology of "long money and long investment", E Fund said that personal pensions will be rolled out nationwide. First, personal pensions will benefit more residents, which will help raise residents' awareness of pension reserves and promote pension planning and investment concepts to be more deeply rooted in the hearts of the people. Second, it is conducive to further improving the multi-level and multi-pillar pension system and promoting the sustainable development of China's pension system. Third, it is expected to bring more medium and long-term funds to the capital market and help the high-quality development of the financial market.Zuckerberg is reported to have donated $1 million to Trump's inauguration fund. Zuckerberg's donation is the latest move to strengthen relations with Trump.

Sumeida: The first batch of production equipment was shipped out of Malaysia's sunscreen series products project. According to Sumeida, in the fourth quarter of 2024, Sumeida went all out to sprint the annual target and task, and the project of Malaysia's sunscreen series products with an annual output of 10,000 tons cooperated with Nanjing Kesi Chemical Co., Ltd. realized the first batch of production equipment delivery, adding more help to escort domestic customers to the sea. The equipment shipped this time includes storage tanks, reaction vessels, distillation columns, dryers, etc. The total cargo volume is estimated to be nearly 80,000 cubic meters, which will be used for the production of various sunscreens in customers' factories in Malaysia. In recent years, technology companies have kept up with the upsurge of enterprises going to sea in China, and are committed to providing comprehensive service solutions for Chinese enterprises going to sea. In the first three quarters of this year, the cumulative amount of mechanical and electrical equipment shipped by technology companies increased by 363% year-on-year.Chongqing Branch of the People's Bank of China investigates Chongqing Water Environment Group: Support Chongqing Water Environment Group's demands for integration and optimization. Recently, Wenjiang Yong, member of the Party Committee and vice president of Chongqing Branch of the People's Bank of China (Chongqing Branch of the State Administration of Foreign Exchange), and his party visited Chongqing Water Environment Group to conduct in-depth research on the "three challenges and one revitalization" of state-owned enterprise reform deployed by the Municipal Party Committee. He stressed that it is necessary to give full play to the function of foreign exchange management, solve problems for enterprises, and support the related work involving integration and optimization in Chongqing Water Environment Group's "Three Attacks and One Revitalization". At the symposium, Wen Jiangyong and his party listened to Lu Xian's introduction on the basic situation of Chongqing Water Environment Group and the report of the head of Derun Environment Company on the difficulties related to the company's integration and optimization and the matters for support. Wen Jiangyong pointed out that on the basis of grasping the fairness of transactions and the balance of cross-border funds, he will solve problems for enterprises according to specific conditions and support Chongqing Water Environment Group's related demands for integration and optimization. At the same time, in the future work, the two sides should strengthen communication and help enterprises grow and develop.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)